Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering is a journal indexed in SJR in Mechanical Engineering with an H index of 21. It has an SJR impact factor of 0,103 and it has a best quartile of Q4. It is published in English. It has an SJR impact factor of 0,103.
Metrics
Scimago and CountryOfPapers database fields
SJR Impact
0,103
H-index
21
Docs (year)
143
Docs 3y
473
Total refs
1362
Cites 3y
14
Citable 3y
420
Cites/Doc 2y
0.03
Ref/Doc
9.52
Immediate OA
—
Embargoed OA
NPD
Non OA / Submission
—
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Researcher reviews
Best articles by citations
Performance of AZARASHI (Seal) Positioning Mechanism with Friction Control by Inertial Force
View moreInfluence of Non-uniform Contact Condition on Thermal Contact Resistance of the Joint
View moreIntelligent Process Planning System for End-milling Process (2nd Report)
View moreLaser Cleaving of Wafer for Electric Devices
View moreLaser Induced Modification in Glasses by CW Laser Backside Irradiation (CW-LBI)
View moreLearning from the Society for Precision Engineering
View moreLife Cycle Design
View moreMiniaturization Challenges and Their Impact on the Micro-factory Concept and Manipulators
View moreMinimal Manufacturing of Developing Factory System for Micro Electro-Mechanical Systems Devices
View moreNanoimprint Total Solution
View moreObservation of Crack Propagation Behavior and Visualization of Internal Stress Field during Wheel Scribing of Glass Sheet
View moreHigh-Speed Milling of Rubber (1st Report)
View morePhase Modulation Homodyne Displacement Measuring Interferometer using Tunable Laser Diode as Light Source
View morePrecision Breaking of a Liquid Crystal Display Panel (STN Type) by YAG Laser.
View moreRecent Progress in Electrical Discharge Machining. Coloring Method of Titanium Alloy Using EDM Process.
View moreSimulation of Manufacturing System under Ubiquitous Environment
View moreSmall-hole Electrical Discharge Machining Using a Maglev Actuator
View moreStudies on Cleaving Mechanism of Silicon Wafer with Pulsed YAG Laser.
View moreStudy on Externally Pressurized Gas Bearings with Infinite Stiffness (2nd Report)
View moreStudy on mechanism of burr formation in drilling. Deformation of material during burr formation.
View moreStudy on Movable Pins Input Type Trochoid Gear Reducer (2nd Report)
View moreThe Technology of Linear Motion Ball Guide for Super Rigidity and Super Running Accuracy in a Narrow Range
View moreDevelopment of Ultrasonically Assisted Dicing Saw and the Application in Semiconductor Device
View moreA Proposal of Robust Gaussian Filter by Using Fast M-Estimation Method
View more