Circuit World
Circuit World is a journal indexed in SJR in Industrial and Manufacturing Engineering and Electrical and Electronic Engineering with an H index of 26. It has an SJR impact factor of 0,271 and it has a best quartile of Q3. It is published in English. It has an SJR impact factor of 0,271.
Metrics
Scimago and CountryOfPapers database fields
SJR Impact
0,271
H-index
26
Docs (year)
33
Docs 3y
128
Total refs
937
Cites 3y
181
Citable 3y
127
Cites/Doc 2y
1.28
Ref/Doc
28.39
Immediate OA
—
Embargoed OA
NPD
Non OA / Submission
—
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Researcher reviews
Best articles by citations
An understanding of the structure and geography of the subcontract PCB industry in the UK
View moreVisual In-process Inspection
View moreDesign for Plastic Ball Grid Array Solder Joint Reliability
View moreDesign Assessment of a Pressure Contact Connector System
View moreConductive filament formation failure in a printed circuit board
View moreCharacterization of a non-woven randomly dispersed short fiber laminate
View moreChanges in the PCB world with new packaging technologies and the integration of passive components into the PCB
View moreBinary memcapacitor based first-order active filter
View moreAssessing lead-free intellectual property
View moreAre PCB fabricators ready to fabricate MCM-L technology?
View moreAqueous base compatible waveguide materials for optical interconnect applications
View moreApplication of simulation tools for the technology-driven planning of a PCB-production line
View moreAnalysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations
View more18 µm electrodeposited copper foil for flex fatigue applications
View moreAn overview of microvia technology
View moreAn introduction to laser direct imaging for high density interconnects
View moreAlternative surface finishes -options and environmental considerations
View moreAllowable copper thickness for fine pitch patterns formed by a subtractive method
View moreA third-generation circuit printing process
View moreA novel copper electroplating formula for laser-drilled micro via and through hole filling
View moreA new small CTE system from COPNA resin/E-glass fabrics
View moreA new phase for vapour-phase -an overview of the current status of vapour phase technology for soldering and related applications
View moreA new approach to translational laminographic method for PCB inspection
View moreA low-cost solder-bumped chip scale package -NuCSP
View more