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verified SJR 0,271 · Q3 • database Scopus / SJR & Web of Science indexed
Circuit World
United Kingdom · Emerald Group Publishing Ltd...
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Circuit World

Circuit World is a journal indexed in SJR in Industrial and Manufacturing Engineering and Electrical and Electronic Engineering with an H index of 26. It has an SJR impact factor of 0,271 and it has a best quartile of Q3. It is published in English. It has an SJR impact factor of 0,271.

ISSN: 0305-6120
Publisher: Emerald Group Publishing Ltd.
Category: Industrial and Manufacturing Engineering
Indexation: verifiedScopus / SJR verifiedWeb of Science
open_in_new Portal NPD menu_book Guidelines NPD
schedule CountryOfPapers database fields
SJR Impact Factor trending_up
0,271 Q3
H-index 26
Acceptance rate pie_chart
39%
Source Acceptance_Rate
Time to publication hourglass_top
NPD
Field NPD
Publication cost (APC) payments
NPD Subscription
Non-OA path NPD

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR Web of Science

SJR Impact

0,271

H-index

26

Docs (year)

33

Docs 3y

128

Total refs

937

Cites 3y

181

Citable 3y

127

Cites/Doc 2y

1.28

Ref/Doc

28.39

Immediate OA

—

Embargoed OA

NPD

Non OA / Submission

—

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Best articles by citations

An understanding of the structure and geography of the subcontract PCB industry in the UK

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Visual In-process Inspection

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Design for Plastic Ball Grid Array Solder Joint Reliability

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Design Assessment of a Pressure Contact Connector System

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Conductive filament formation failure in a printed circuit board

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Characterization of a non-woven randomly dispersed short fiber laminate

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Changes in the PCB world with new packaging technologies and the integration of passive components into the PCB

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Binary memcapacitor based first-order active filter

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Assessing lead-free intellectual property

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Are PCB fabricators ready to fabricate MCM-L technology?

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Aqueous base compatible waveguide materials for optical interconnect applications

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Application of simulation tools for the technology-driven planning of a PCB-production line

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Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

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18 µm electrodeposited copper foil for flex fatigue applications

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An overview of microvia technology

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An introduction to laser direct imaging for high density interconnects

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Alternative surface finishes -options and environmental considerations

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Allowable copper thickness for fine pitch patterns formed by a subtractive method

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A third-generation circuit printing process

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A novel copper electroplating formula for laser-drilled micro via and through hole filling

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A new small CTE system from COPNA resin/E-glass fabrics

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A new phase for vapour-phase -an overview of the current status of vapour phase technology for soldering and related applications

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A new approach to translational laminographic method for PCB inspection

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A low-cost solder-bumped chip scale package -NuCSP

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