ISSN: 0305-6120

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Circuit World Q3 Unclaimed

Emerald Group Publishing Ltd. United Kingdom

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Circuit World is a journal indexed in SJR in Industrial and Manufacturing Engineering and Electrical and Electronic Engineering with an H index of 25. It has an SJR impact factor of 0,288 and it has a best quartile of Q3. It is published in English. It has an SJR impact factor of 0,288.

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy:

Type of publications:

Publication frecuency: -

Categories: Electrical and Electronic Engineering (Q3) Industrial and Manufacturing Engineering (Q3)

Price

- €

Inmediate OA

NPD

Embargoed OA

- €

Non OA

Metrics

0,288

SJR Impact factor

25

H Index

49

Total Docs (Last Year)

144

Total Docs (3 years)

1592

Total Refs

238

Total Cites (3 years)

143

Citable Docs (3 years)

1.63

Cites/Doc (2 years)

32.49

Ref/Doc

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Aims and Scope

Best articles by citations

Conductive filament formation failure in a printed circuit board

A new approach to translational laminographic method for PCB inspection

An introduction to laser direct imaging for high density interconnects

Reliability of flip chips on FR-4 assembled with reduced process steps

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Design for Plastic Ball Grid Array Solder Joint Reliability

A design method of capacitor arrays for high-resolution SAR ADCs

An overview of microvia technology

Design, analysis and measurement of the cost-effective substrate of a plastic ball grid array package - NuBGA

Aqueous base compatible waveguide materials for optical interconnect applications

Flexible circuitry - technology background and important fundamental issues

Optimal printed wiring board design for high I/O density chip size packages

SHOW MORE ARTICLES

Organic substrates for environmentally friendly electronic devices

Effects of conductor surface condition on signal integrity

Assessing lead-free intellectual property

Allowable copper thickness for fine pitch patterns formed by a subtractive method

Specially developed glass fabrics for ultimate small diameter holes of high density board by build-up method

Environmental Management in Electronics Manufacturing*

Modelling of temperature distribution along PCB thickness in different substrates during reflow

Binary memcapacitor based first-order active filter

Laser direct imaging and improved process capability

Characterization of a non-woven randomly dispersed short fiber laminate

Market trends of sequential build-up (SBU) printed wiring boards (PWB) in Japan

A novel copper electroplating formula for laser-drilled micro via and through hole filling