ISSN: 2156-3950
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IEEE Transactions on Components, Packaging and Manufacturing Technology Q2 Unclaimed
IEEE Transactions on Components, Packaging and Manufacturing Technology is a journal indexed in SJR in Industrial and Manufacturing Engineering and Electronic, Optical and Magnetic Materials with an H index of 114. It has a price of 2040 €. It has an SJR impact factor of 0,562 and it has a best quartile of Q2. It has an SJR impact factor of 0,562.
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2040 €
Inmediate OANPD
Embargoed OA0 €
Non OAMetrics
0,562
SJR Impact factor114
H Index222
Total Docs (Last Year)683
Total Docs (3 years)7061
Total Refs1758
Total Cites (3 years)678
Citable Docs (3 years)2.66
Cites/Doc (2 years)31.81
Ref/DocOther journals with similar parameters
The International Journal of Advanced Manufacturing Technology Q2
Green Processing and Synthesis Q2
Production and Manufacturing Research Q2
Human Factors and Ergonomics In Manufacturing Q2
Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture Q2
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Aims and Scope
Best articles by citations
Peak-to-Peak Ground Noise on a Power Distribution TSV Pair as a Function of Rise Time in 3-D Stack of Dies Interconnected Through TSVs
View moreEffects of the Mechanical Properties of Polymer Resin and the Conductive Ball Types of Anisotropic Conductive Films on the Bending Properties of Chip-in-Flex Package
View moreFast Transient Analysis of Tightly Coupled Interconnects via Overlapping Partitioning and Model-Order Reduction
View moreEffects of Sintering Pressure on the Densification and Mechanical Properties of Nanosilver Double-Side Sintered Power Module
View moreChip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure
View moreEmbedded Active Packaging Technology for High-Pin-Count LSI With Cu Plate
View more3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections
View moreInvestigation on the Influence of Nanofluids in Wavy Microchannel Heat Sink
View moreVariations in Micromachined Isolator Geometries for Sensor Performance in Harsh Environments
View moreReliability of liquid crystal polymer air cavity packaging
View moreStudy on Electrical Properties of AgSnO2 Contact Materials Doped With Rare-Earth La, Ce, and Y
View moreMetal Layer Losses in Thin-Film Microstrip on LTCC
View moreModeling, Fabrication, and Characterization of Large Carbon Nanotube Interconnects With Negative Temperature Coefficient of the Resistance
View moreIncapability of Drilling With a High-Power-Density Beam
View moreA Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications
View moreInvestigation of the Cause of a Malfunction in a Display Package and Its Solution
View moreEvaluation of CSAM for Plastic-Encapsulated Microcircuit Dormant Storage Testing
View moreVolume Shrinkage Characterization of Underfill Materials
View moreImproving Gold/Gold Microcontact Performance and Reliability Under Low-Frequency AC Through Circuit Loading
View moreEffect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films
View moreExperimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging
View moreA Systematic Method for the Passivity Enforcement of Delayed Rational Macromodels
View moreCharacterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications
View moreLow-Pressure Joining of Large-Area Devices on Copper Using Nanosilver Paste
View more
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