verified SJR 0,716 · Q1 • database Scopus / SJR & Web of Science indexed

United States · Institute of Electrical and...

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IEEE Transactions on Components, Packaging and Manufacturing Technology

IEEE Transactions on Components, Packaging and Manufacturing Technology is a journal indexed in SJR in Industrial and Manufacturing Engineering and Electronic, Optical and Magnetic Materials with an H index of 119. It has a price of 2040 €. It has an SJR impact factor of 0,716 and it has a best quartile of Q1. It has an SJR impact factor of 0,716.

ISSN: 2156-3950

Publisher: Institute of Electrical and Electronics Engineers Inc.

Category: Industrial and Manufacturing Engineering

Indexation: verifiedScopus / SJR verifiedWeb of Science

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schedule CountryOfPapers database fields

SJR Impact Factor trending_up

0,716 Q1

H-index 119

Acceptance rate pie_chart

30% Selective

Source Acceptance_Rate

Time to publication hourglass_top

NPD

Field NPD

Publication cost (APC) payments

2.040 € Subscription

Non-OA path 0 €

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR Web of Science

SJR Impact

0,716

H-index

119

Docs (year)

278

Docs 3y

664

Total refs

8875

Cites 3y

2441

Citable 3y

661

Cites/Doc 2y

3.53

Ref/Doc

31.92

Immediate OA

2040 €

Embargoed OA

NPD

Non OA / Submission

0 €

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Best articles by citations

Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications

Volume Shrinkage Characterization of Underfill Materials

Design and Development of Multi-Die Laterally Placed and Vertically Stacked Embedded Micro-Wafer-Level Packages

Cross Flow Heat Exchanger Modeling of Transient Temperature Input Conditions

Creep Behaviors of Sn0.7Cu0.1Co0.05Ni/Cu Soldering Joints

Correlation Between Solder Joint Fatigue Life and Accumulated Work in Isothermal Cycling

Corrections to Graham's Law of Effusion for Predicting Leak Rates Through Hermetic Seals

Conductive Adhesives From Low-VOC Silver Inks for Advanced Microelectronics Applications

Common-Mode Noise Reduction Schemes for Weakly Coupled Differential Serpentine Delay Microstrip Lines

Classification of Solder Joint Using Feature Selection Based on Bayes and Support Vector Machine

Circuit Models of Carbon-Based Interconnects for Nanopackaging

Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure

SHOW MORE ARTICLES

Characterization Methods for Ultrathin Wafer and Die Quality: A Review

3-D Packaging With Through-Silicon Via (TSV) for Electrical and Fluidic Interconnections

Challenges for Capillary Self-Assembly of Microsystems

Behavioral Modeling of IC Core Power-Delivery Networks From Measured Data

Application of Sequence-Dependent Traveling Salesman Problem in Printed Circuit Board Assembly

An Experimental and Numerical Investigation Into Wafer Probing Parameters Based on Thin Wafer Breaking Strength

A Wideband On-Interposer Passive Equalizer Design for Chip-to-Chip 30-Gb/s Serial Data Transmission

A Systematic Method for the Passivity Enforcement of Delayed Rational Macromodels

A Study on the Failure Mechanism and Enhanced Reliability of Sn58Bi Solder Anisotropic Conductive Film Joints in a Pressure Cooker Test Due to Polymer Viscoelastic Properties and Hydroswelling

A Study on the Bonding Conditions and Nonconductive Filler Contents on Cationic Epoxy-Based Sn-58Bi Solder ACFs Joints for Reliable Flex-on-Board Applications

A Silicon-Based LED Packaging Substrate With an Island Structure for Phosphor Encapsulation Shaping

A Novel Layer Stack-Up With Free Cavity Resonance for High-Performance Power Noise Suppression

FAQs

IEEE Transactions on Components, Packaging and Manufacturing Technology has an SJR of 0,716 (best quartile Q1) in the CountryOfPapers database.

Immediate OA APC is 2040 EUR. Non-OA / submission fee is 0 EUR.

The acceptance rate recorded for IEEE Transactions on Components, Packaging and Manufacturing Technology is 30%.

IEEE Transactions on Components, Packaging and Manufacturing Technology

Metrics

Name good journals. Call out predatory ones.

Researcher reviews

Best articles by citations

FAQs

What is the SJR of IEEE Transactions on Components, Packaging and Manufacturing Technology?

What is the APC / publication cost?

What is the acceptance rate?