Default: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

ISSN: 0734-2101

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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films Q2 Unclaimed

AVS Science and Technology Society United States
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Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films is a journal indexed in SJR in Surfaces, Coatings and Films and Condensed Matter Physics with an H index of 123. It has a price of 1250 €. It has an SJR impact factor of 0,569 and it has a best quartile of Q2. It is published in English. It has an SJR impact factor of 0,569.

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films focuses its scope in these topics and keywords: deposition, ion, plasma, etching, sio, beam, films, oxide, atomic, vapor, ...

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy:

Type of publications:

Publication frecuency: -

Price

1250 €

Inmediate OA

NPD

Embargoed OA

0 €

Non OA

Metrics

Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

0,569

SJR Impact factor

123

H Index

334

Total Docs (Last Year)

840

Total Docs (3 years)

15243

Total Refs

2226

Total Cites (3 years)

832

Citable Docs (3 years)

2.18

Cites/Doc (2 years)

45.64

Ref/Doc

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Aims and Scope


deposition, ion, plasma, etching, sio, beam, films, oxide, atomic, vapor, surface, silicon, gas, kev, xray, scanning, scale, cluster, coupled, diamondlike, doping, growth, inductively, investigation, layer, molybdenum, nitride, process,



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Reactive physical vapor deposition of TixAlyN: Integrated plasma-surface modeling characterization

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Epitaxial growth of high-k BaxSr1-xTiO3 thin films on SrTiO3 (001) substrates by atomic layer deposition

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Zirconia-alumina nanolaminate for perforated pitting corrosion protection of stainless steel

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Thermal stability of Pr[sub 2]O[sub 3] films grown on Si(100) substrate

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Preferred orientation and film structure of TaN films deposited by reactive magnetron sputtering

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Experimental and computer simulation studies of the "baffled target" reactive sputtering process

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