ISSN: 0954-0911

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Soldering and Surface Mount Technology Q3 Unclaimed

Emerald Group Publishing Ltd. United Kingdom

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Soldering and Surface Mount Technology is a journal indexed in SJR in Materials Science (miscellaneous) and Condensed Matter Physics with an H index of 38. It has an SJR impact factor of 0,314 and it has a best quartile of Q3. It is published in English. It has an SJR impact factor of 0,314.

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy:

Type of publications:

Publication frecuency: -

Categories: Condensed Matter Physics (Q3) Electrical and Electronic Engineering (Q3) Materials Science (miscellaneous) (Q3)

Price

- €

Inmediate OA

NPD

Embargoed OA

- €

Non OA

Metrics

0,314

SJR Impact factor

38

H Index

43

Total Docs (Last Year)

86

Total Docs (3 years)

1359

Total Refs

170

Total Cites (3 years)

86

Citable Docs (3 years)

1.62

Cites/Doc (2 years)

31.6

Ref/Doc

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Physics and Chemistry of Minerals Q3
Journal of Renewable Materials Q3
Aerosol Science and Engineering Q3
The European Physical Journal E Q3

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Aims and Scope

Best articles by citations

Survey of rework practices in the UK electronics assembly industry

Analysis of crack growth in solder joints

Analysis on solder ball shear testing conditions with a simple computational model

Engineering solder paste performance through controlled stress rheology analysis

The impact of process parameters on gold elimination from soldered connector assemblies

Stencil design for mixed technology through-hole/SMT placement and reflow

Thermal strain analysis of an electronics package using the SEM Moire technique

Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

The impact of underfill properties on the thermomechanical reliability of FCOB assembly

Reduction of voiding in eutectic ball grid array solder joints

The application of IR thermography to process monitoring and control of reflow soldering

Ceramic chip scale package solder joint reliability

SHOW MORE ARTICLES

Novel techniques for electronic component removal

Advanced alloy for lead-free solder balls

Design, materials and process for lead-free assembly of high-density packages

Materials behaviour and the reliability in performance of solder joints

Evolution of curvature under thermal cycling in sandwich assembly bonded by sintered nanosilver paste

Characterization of a solder paste printing process and its optimization

Evaluation of two novel lead-free surface finishes

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Correlation of solder paste rheology with computational simulations of the stencil printing process

Enhancement of underfill encapsulants for flip-chip technology

Evaluation of pre-deposited (no-flow) underfill for flip chip and CSP assembly

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders