verified SJR 0,314 · Q3 • database Scopus / SJR & Web of Science indexed

United Kingdom · Emerald Group Publishing Ltd...

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Soldering and Surface Mount Technology

Soldering and Surface Mount Technology is a journal indexed in SJR in Materials Science (miscellaneous) and Condensed Matter Physics with an H index of 38. It has an SJR impact factor of 0,314 and it has a best quartile of Q3. It is published in English. It has an SJR impact factor of 0,314.

ISSN: 0954-0911

Publisher: Emerald Group Publishing Ltd.

Category: Materials Science (miscellaneous)

Indexation: verifiedScopus / SJR verifiedWeb of Science

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schedule CountryOfPapers database fields

SJR Impact Factor trending_up

0,314 Q3

H-index 38

Acceptance rate pie_chart

35%

Source Acceptance_Rate

Time to publication hourglass_top

NPD

Field NPD

Publication cost (APC) payments

NPD Subscription

Non-OA path NPD

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR Web of Science

SJR Impact

0,314

H-index

Docs (year)

Docs 3y

Total refs

1359

Cites 3y

170

Citable 3y

Cites/Doc 2y

1.62

Ref/Doc

31.6

Immediate OA

—

Embargoed OA

NPD

Non OA / Submission

—

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Best articles by citations

Reduction of voiding in eutectic ball grid array solder joints

Viscoplastic Anand model for solder alloys and its application

The impact of underfill properties on the thermomechanical reliability of FCOB assembly

The impact of process parameters on gold elimination from soldered connector assemblies

The effect of PECVD SiNxmoisture barrier layers on the degradation of a flip chip underfill material

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflow

Thermal fatigue cracking of surface mount conductive adhesive joints

Solder joint reliability of cavity-down plastic ball grid array assemblies

Solder joint inspection using eigensolder features

Solder joint defect classification based on ensemble learning

Solder ball failure mechanisms in plastic ball grid array packages

Rework of CSP: the effect on surface intermetallic growth

SHOW MORE ARTICLES

Solder joint reliability of plastic ball grid array packages

Reducing bonding cycle time of adhesive flip chip process

Reactions between Sn-Ag-Cu lead-free solders and the Au/Ni surface finish in advanced electronic packages

Predictive reliability models through validated correlation between power cycling and thermal cycling accelerated life tests

PBGA solder ball coplanarity impact evaluation

Optimizing the reflow profile via defect mechanism analysis

Optimisation modelling for flip-chip solder joint reliability

Numerical modelling of solder joint formation

Numerical modelling of scanned beam laser soldering of fine pitch packages

Novel techniques for electronic component removal

New High Thermal Conductivity Thermoplastics for Power Applications

Microstructure investigation of Sn-0.5Cu-3.5Ag and Sn-3.5Ag-0.5Cu-0.5B lead-free solders

FAQs

Soldering and Surface Mount Technology has an SJR of 0,314 (best quartile Q3) in the CountryOfPapers database.

Immediate OA APC is not available (NPD).

The acceptance rate recorded for Soldering and Surface Mount Technology is 35%.

Soldering and Surface Mount Technology

Metrics

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Researcher reviews

Best articles by citations

FAQs

What is the SJR of Soldering and Surface Mount Technology?

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What is the acceptance rate?