ISSN: 1551-4897

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Journal of Microelectronics and Electronic Packaging Q4 Unclaimed

IMAPS-International Microelectronics and Packaging Society United States

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Journal of Microelectronics and Electronic Packaging is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering with an H index of 18. It has an SJR impact factor of 0,205 and it has a best quartile of Q4. It has an SJR impact factor of 0,205.

Type: Journal

Type of Copyright:

Languages:

Open Access Policy:

Type of publications:

Publication frecuency: -

Categories: Computer Networks and Communications (Q4) Electrical and Electronic Engineering (Q4) Electronic, Optical and Magnetic Materials (Q4)

Price

- €

Inmediate OA

NPD

Embargoed OA

- €

Non OA

Metrics

Journal of Microelectronics and Electronic Packaging

0,205

SJR Impact factor

18

H Index

8

Total Docs (Last Year)

56

Total Docs (3 years)

178

Total Refs

34

Total Cites (3 years)

55

Citable Docs (3 years)

0.51

Cites/Doc (2 years)

22.25

Ref/Doc

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Aims and Scope

Best articles by citations

FCCSP IMC Growth under Reliability Stress Following Automotive Standards

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Thermo-mechanical Simulations for Single-Sided and Double-Sided Cooling Power Packages

Thermal Stability of Intermetallic Cu-Sn Interconnections for High Temperature Applications

Review of Devices, Packaging, and Materials for Cryogenic Optoelectronics

Modeling, Design, Fabrication, and Characterization of Ultra-High Bandwidth 3-D Glass Photonic Substrates

An Advanced Extreme-Environment Wireless Telemetry System for Turbine Blade Instrumentation

Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)

Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor Applications

Development of an SiC Multichip Phase-Leg Module for High-Temperature and High-Frequency Applications

Temporary Wafer Bonding Materials with Mechanical and Laser Debonding Technologies for Semiconductor Device Processing

Reliability of Novel Ceramic Encapsulation Materials for Electronic Packaging

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Thermal Interface Materials and Cooling Technologies in Microelectronic Packaging - A Critical Review

Proposal of Ultrafine and High Reliable Trench Wiring Process for Organic Interposer

Design and Demonstration of Fine-Pitch and High-Speed Redistribution Layers for Panel-Based Glass Interposers at 40-¬µm Bump Pitch

Design and Demonstration of Glass Panel Embedding for 3D System Packages for Heterogeneous Integration Applications

Low Temperature Cofiring and Dielectric Properties of Ca-Doped Al2O3/K2O3-B2O3-SiO2 Composite Ceramics for LTCC Applications

High-Temperature Anisotropic Magnetoresistive (AMR) Sensors

Fabrication and Characterization of Vibration and Wind Energy Harvesters Using Multilayer Free-Standing Piezoelectric Thick Films

Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology

Extended High-Temperature Operation of Silicon Carbide CMOS Circuits for Venus Surface Application