verified SJR 0,157 · Q4 • database Scopus / SJR indexed

United States · IMAPS-International Microele...

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Journal of Microelectronics and Electronic Packaging

Journal of Microelectronics and Electronic Packaging is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering with an H index of 21. It has an SJR impact factor of 0,157 and it has a best quartile of Q4. It has an SJR impact factor of 0,157.

ISSN: 1551-4897

Publisher: IMAPS-International Microelectronics and Packaging Society

Category: Electronic, Optical and Magnetic Materials

Indexation: verifiedScopus / SJR

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schedule CountryOfPapers database fields

SJR Impact Factor trending_up

0,157 Q4

H-index 21

Acceptance rate pie_chart

43%

Source Acceptance_Rate

Time to publication hourglass_top

NPD

Field NPD

Publication cost (APC) payments

NPD Subscription

Non-OA path NPD

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR

SJR Impact

0,157

H-index

Docs (year)

Docs 3y

Total refs

162

Cites 3y

Citable 3y

Cites/Doc 2y

0.74

Ref/Doc

16.2

Immediate OA

—

Embargoed OA

NPD

Non OA / Submission

—

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Best articles by citations

Addressing Flux Dip Challenges for 3-D Integrated Large Die, Ultrafine Pitch Interconnect

Toward Integrated Pressure Sensors for Temperatures up to 600ºC

Cu Pillar Bump Development for 7-nm Chip Package Interaction (CPI) Technology

Critical Issues of TSV and 3D IC Integration

Component Attachment with Pressureless Ag Sintering for 300ºC Applications

Combustion Heat Meter

Combining Fine Line Photoimageable with Multi-Step Thick Film for Improved Circuit Density

Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics

Collective Cu-Cu Thermocompression Bonding Using Pillars

Characterization of Mechanical Properties and Creep Behavior of Woven Glass/Epoxy Substrates by Nanoindentation

Broadband Dielectric Characterization of Aluminum Oxide (Al2O3)

An Electronic Packaging Approach to Improving an Environmental Sensor and Sensing Technique

SHOW MORE ARTICLES

An Advanced Extreme-Environment Wireless Telemetry System for Turbine Blade Instrumentation

3D Integrated High-Precision Passives on Thin Glass Substrates for Miniaturized and High-Performance RF Components

Additive Manufacturing Design and Fabrication of Ceramic Cylindrical Ion Trap Mass Analyzer Chips for Miniaturized Mass Spectrometer Smart-Device (Internet of Things) Applications

Adaption of Functional Ceramic Materials for the Laser Sintering Process in Integrated Sensor Applications

A Technique for Detecting Moisture Absorption in Printed Circuit Boards

A Simple Method for Thermal Characterization of Stacked Die Electronic Packages in Staggered Arrangement

A Resistive GaN-HEMT Mixer for a Cable Modem Operable up to 250ºC for Downhole Communications

A PCB Environmental Sensor for Use in Monitoring Drought Conditions in Estuaries

A Numerical Study on Mitigation of Flying Dies in Compression Molding of Microelectronic Packages

A New In-Line Laser-Based Acoustic Technique for Pillar Bump Metrology

A Comparison Between Solders & Transient Liquid Phase Sintered Interconnects in High Temperature Multilayer Ceramic Capacitors

A Capacitive Pressure Sensor Based on Cofirable Ceramic/Glass Materials with LTCC Technology

FAQs

Journal of Microelectronics and Electronic Packaging has an SJR of 0,157 (best quartile Q4) in the CountryOfPapers database.

Immediate OA APC is not available (NPD).

The acceptance rate recorded for Journal of Microelectronics and Electronic Packaging is 43%.

Journal of Microelectronics and Electronic Packaging

Metrics

Name good journals. Call out predatory ones.

Researcher reviews

Best articles by citations

FAQs

What is the SJR of Journal of Microelectronics and Electronic Packaging?

What is the APC / publication cost?

What is the acceptance rate?