ISSN: 1356-5362

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Microelectronics International Q4 Unclaimed

Emerald Group Publishing Ltd. United Kingdom

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Microelectronics International is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Surfaces, Coatings and Films with an H index of 25. It has a price of 2655 €. It has an SJR impact factor of 0,188 and it has a best quartile of Q4. It is published in English. It has an SJR impact factor of 0,188.

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy:

Type of publications:

Publication frecuency: -

Categories: Atomic and Molecular Physics, and Optics (Q4) Condensed Matter Physics (Q4) Electrical and Electronic Engineering (Q4) Electronic, Optical and Magnetic Materials (Q4) Surfaces, Coatings and Films (Q4)

Price

2655 €

Inmediate OA

NPD

Embargoed OA

0 €

Non OA

Metrics

0,188

SJR Impact factor

25

H Index

36

Total Docs (Last Year)

72

Total Docs (3 years)

940

Total Refs

70

Total Cites (3 years)

71

Citable Docs (3 years)

0.84

Cites/Doc (2 years)

26.11

Ref/Doc

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Aims and Scope

Best articles by citations

Development of a reliable packaging process for flip chip on ceramics

Wafer level packaging of compliant, chip size ICs

Effects of material parameters and processing conditions on high voltage sensitivity of polymer thick film resistors

Investigation into the curing and thermal behavior of an epoxy-based UV curable coating in microelectronics assembly

Current noise of trimmed thick-film resistors: measurement and simulation

Some results obtained with diffusion patterning technology

Characteristics of passive Ta-resistive planes embedded in Al-sheet "PCB" - compatible for integrated MCM-substrates or packaging carriers

An investigation of the effect of poling conditions on the characteristics of screen-printed piezoceramics

Electrical characterisation of BGA package for RF applications

High density interconnect substrates using multilayer thin film technology on laminate substrates (MCM-SL/D)

Using LTCC for microsystems

Pros and cons of thermoplastic and thermoset polymer adhesives in microelectronic assembly applications

SHOW MORE ARTICLES

New approach for calculation of line parameters of IC interconnects

Effects of chip scale package and flip-chip on the design and manufacturing of electronic products

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Resist Coating of Cylindrical Samples for 3-D Lithography

The role of selective electroplating in the construction of advanced circuit boards

Computing electrical potential in unbounded two-dimensional regions

Assembly issues in three flip chip processes

Thick film microstrip rejection filter with improved Q using overlay

Thick film PN-junctions based on mixed oxides of indium and silicon as gamma radiation sensors

Thick film symmetrical EMI LC cells

A five-layer thin film MCM-Si design using oxynitride dielectrics

Embedded passive components and PCB size -thermal effects