verified SJR 0,186 · Q4 • database Scopus / SJR & Web of Science indexed

United Kingdom · Emerald Group Publishing Ltd...

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Microelectronics International

Microelectronics International is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Surfaces, Coatings and Films with an H index of 25. It has a price of 2655 €. It has an SJR impact factor of 0,186 and it has a best quartile of Q4. It is published in English. It has an SJR impact factor of 0,186.

ISSN: 1356-5362

Publisher: Emerald Group Publishing Ltd.

Category: Electronic, Optical and Magnetic Materials

Indexation: verifiedScopus / SJR verifiedWeb of Science

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schedule CountryOfPapers database fields

SJR Impact Factor trending_up

0,186 Q4

H-index 25

Acceptance rate pie_chart

39%

Source Acceptance_Rate

Time to publication hourglass_top

NPD

Field NPD

Publication cost (APC) payments

2.655 € Subscription

Non-OA path 0 €

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR Web of Science

SJR Impact

0,186

H-index

Docs (year)

Docs 3y

Total refs

538

Cites 3y

Citable 3y

Cites/Doc 2y

1.02

Ref/Doc

23.39

Immediate OA

2655 €

Embargoed OA

NPD

Non OA / Submission

0 €

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Best articles by citations

An evaluation of the characteristics of membrane materials suitable for the batch fabrication of dissolved oxygen sensors

Wafer level packaging of compliant, chip size ICs

Delamination and solder flow-out in underfilled and Pb-free flip chips on laminate

Defect evolutions with different temperature injections in MOSFETs

Current noise of trimmed thick-film resistors: measurement and simulation

Cure behavior of a no flow underfill encapsulant

Computing electrical potential in unbounded two-dimensional regions

Characteristics of passive Ta-resistive planes embedded in Al-sheet "PCB" - compatible for integrated MCM-substrates or packaging carriers

Assessing the cost-effectiveness of integrated passives

Assembly issues in three flip chip processes

Assembly and reliability of flip chip on boards using ACAs or eutectic solder with underfill

Analysis of packaging and sealing techniques for microelectronic modules and recent advances

SHOW MORE ARTICLES

An investigation of the effect of poling conditions on the characteristics of screen-printed piezoceramics

A comparative analysis of interconnection technologies for integrated multilayer inductors

An analysis of technology trends within the electronics industry

Advances in microwave MCM-D technology

Achieving Low Moisture Levels in Hermetic Packages containing Silver Glass with Organic Solvent Die Attach Materials

A Zero X-Y Shrinkage Low Temperature Cofired Ceramic Substrate Using Ag and AgPd Conductors for Flip-chip Bonding*

A simple modification of a flip-chip bonder to allow large area chip attach

A novel approach for hybrid optoelectronic circuits: thick-film on glass (TOG)

A new under bump metallurgy for solder bump flip chip applications

A new method for measuring signal integrity in CMOS ICs

A new concept for the use of Al-sheet as integrated substrate for one or multichip module package

A five-layer thin film MCM-Si design using oxynitride dielectrics

FAQs

Microelectronics International has an SJR of 0,186 (best quartile Q4) in the CountryOfPapers database.

Immediate OA APC is 2655 EUR. Non-OA / submission fee is 0 EUR.

The acceptance rate recorded for Microelectronics International is 39%.

Microelectronics International

Metrics

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Researcher reviews

Best articles by citations

FAQs

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