ISSN: 0361-5235

Journal Guideline

Journal of Electronic Materials Q2 Unclaimed

Springer New York United States

Unfortunately this journal has not been claimed yet. For this reason, some information may be unavailable.

Editor’s Choice: Awarded to fewer than 5% of articles published in the journal each year, Editor’s Choice articles are free to read! Review the journal’s full list of Editor’s Choice articles here. The Journal of Electronic Materials is a peer-reviewed scientific journal of The Minerals, Metals & Materials Society (TMS), with a long history of more than 50 years. The journal reports on the science and technology of electronic materials, while examining new applications of various materials. In addition to original research articles, review articles are published on current topics to enable readers to keep abreast of activities in high impact, rapidly evolving topical areas peripheral to their own. The journal strives to publish articles of interest to both specialists and non-specialists in the field of electronic materials. The journal: Examines new applications for semiconductors, metallic and magnetic alloys, insulators, and optical and display materials, and presents methods for fabricating these materials and evaluating their chemical, physical, electronic, and optical properties Describes computational methodologies in the study of electronic materials, including machine learning (ML)-guided materials, fabrication, and devices development; ML-accelerated high-throughput materials characterization; and materials discovery through data mining Publishes research on specific areas of interest such as materials for state-of-the-art transistors, quantum spintronics, nanotechnology, metallization, and superconductivity, and their applications in detectors, emitters, quantum information science and technology, energy, and electronic packaging It has an SJR impact factor of 0,439.

Journal of Electronic Materials focuses its scope in these topics and keywords: nanoparticles, sncu, fieldeffect, eutectic, electronic, electrodeposits, effect, dopant, dimethylzinctriethylaminepiezoelectric, film, ...

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy: Open Choice

Type of publications:

Publication frecuency: -

Categories: Condensed Matter Physics (Q2) Electrical and Electronic Engineering (Q2) Materials Chemistry (Q2) Electronic, Optical and Magnetic Materials (Q3)

Price

2290 €

Inmediate OA

NPD

Embargoed OA

0 €

Non OA

Metrics

0,439

SJR Impact factor

112

H Index

771

Total Docs (Last Year)

2294

Total Docs (3 years)

32933

Total Refs

5489

Total Cites (3 years)

2286

Citable Docs (3 years)

2.37

Cites/Doc (2 years)

42.71

Ref/Doc

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Aims and Scope

Best articles by citations

Shallow-Etch Mesa Isolation of Graded-Bandgap "W"-Structured Type II Superlattice Photodiodes

Study of immersion silver and tin printed-circuit-board surface finishes in lead-free solder applications

Influence of Selenization Time on Microstructural, Optical,

A Study on Sputtered Bi-Te Thermoelectric Films with Various Compositions: Microstructure Evolution and the Effects on Thermoelectric and Electrical Properties

Low-cycle fatigue behavior of Sn-Ag, Sn-Ag-Cu, and Sn-Ag-Cu-Bi lead-free solders

New developments in CdTe and CdZnTe detectors for X and gamma-ray applications

Enhanced Anti-Corrosion Protection of Carbon Steel

Mechanical Behavior of Sn-3.0Ag-0.5Cu/Cu Solder Joints After Isothermal Aging

Correction to: Solution-Processed Insulators for Flexible Metal-Insulator-Metal Structures

Tape-Assisted Transfer of Carbon Nanotube Bundles for Through-Silicon-Via Applications

Modulation Transfer Function Consequences of Planar Dense Array Geometries in Infrared Focal Plane Arrays

Ag Localized Surface Plasma-Modulated NBE Emissions from ZnCdO Thin Films

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The microstructure of eutectic Au-Sn solder bumps on Cu/electroless Ni/Au

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Ethanol-Sensing Characteristics of Nanostructured ZnO: Nanorods, Nanowires, and Porous Nanoparticles

Magnetic Properties of the Double Perovskite Bi2FeCrO6

Kinetics of Solid-State Reactive Diffusion in the (Pd-Ni)/Sn System

Thermal Conductivity of Bi0.5Sb1.5Te3 Affected by Grain Size and Pores

Low Temperature Consolidation of Micro/Nanosilver Die-Attach Preforms

Accelerated Metastable Solid-liquid Interdiffusion Bonding

Improved Light Output of GaN-Based Light-Emitting Diodes by Using AgNi Reflective Contacts

Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions

Local Symmetry Reduction in Lanthanum Substituted Barium Stannate Ceramics Densified Using Bi2O3 Sintering Aids