ISSN: 1043-7398

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Journal of Electronic Packaging, Transactions of the ASME Q2 Unclaimed

The American Society of Mechanical Engineers(ASME) United States

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Journal of Electronic Packaging, Transactions of the ASME is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering with an H index of 58. It has an SJR impact factor of 0,44 and it has a best quartile of Q2. It is published in English. It has an SJR impact factor of 0,44.

Type: Journal

Type of Copyright:

Languages: English

Open Access Policy:

Type of publications:

Publication frecuency: -

Categories: Electrical and Electronic Engineering (Q2) Mechanics of Materials (Q2) Computer Science Applications (Q3) Electronic, Optical and Magnetic Materials (Q3)

Price

- €

Inmediate OA

NPD

Embargoed OA

- €

Non OA

Metrics

Journal of Electronic Packaging, Transactions of the ASME

0,44

SJR Impact factor

58

H Index

69

Total Docs (Last Year)

183

Total Docs (3 years)

2806

Total Refs

378

Total Cites (3 years)

176

Citable Docs (3 years)

1.87

Cites/Doc (2 years)

40.67

Ref/Doc

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Aims and Scope

Best articles by citations

Forced Convection Board Level Thermal Design Methodology for Electronic Systems

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

Finite Element Analysis of Stress Singularities in Attached Flip Chip Packages

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

New Section in the Journal: Reliability of Microelectronics, Photonics and MEMS Materials and Packages

Formation of Surface Microcrack for Separation of Nonmetallic Wafers Into Chips

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

LGA Connectors: An Automated Design Technique for a Shrinking Design Space

Micro-Mechanical Deformation Analysis of Surface Laminar Circuit in Organic Flip-Chip Package: An Experimental Study

The Challenges of Electronic Cooling: Past, Current and Future

Thermal Strain Measurements in Electronic Packages Through Fractional Fringe Moire¬¥ Interferometry

SHOW MORE ARTICLES

Effects of Strain Rate and Amplitude Variations on Solder Joint Fatigue Life in Isothermal Cycling

Effect of Moisture on the Interfacial Adhesion of the Underfill/Solder Mask Interface

Time- and Temperature-Dependent Thermo-Mechanical Modeling of a Packaging Molding Compound and its Effect on Packaging Process Stresses

Mesh Sensitivity and FEA for Multi-Layered Electronic Packaging

Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device

Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet Computer

Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

Electrical Conductive Characteristics of Anisotropic Conductive Adhesive Particles

Thermal Management of Outdoor Electronic Cabinets Using Soil Heat Exchangers

Three- and Four-Point Bend Testing for Electronic Packages

Development of Reliability and Moldability on Fine Pitch Ball Grid Array by Optimizing Materials

Thermal Management of Surface Mount Power Magnetic Components