verified SJR 0,524 · Q2 • database Scopus / SJR & Web of Science indexed

United States · American Society of Mechanic...

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Journal of Electronic Packaging, Transactions of the ASME

Journal of Electronic Packaging, Transactions of the ASME is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Electrical and Electronic Engineering with an H index of 65. It has an SJR impact factor of 0,524 and it has a best quartile of Q2. It is published in English. It has an SJR impact factor of 0,524.

ISSN: 1043-7398

Publisher: American Society of Mechanical Engineers (ASME)

Category: Electronic, Optical and Magnetic Materials

Indexation: verifiedScopus / SJR verifiedWeb of Science

open_in_new Portal NPD menu_book Guidelines NPD

schedule CountryOfPapers database fields

SJR Impact Factor trending_up

0,524 Q2

H-index 65

Acceptance rate pie_chart

29% Selective

Source Acceptance_Rate

Time to publication hourglass_top

NPD

Field NPD

Publication cost (APC) payments

NPD Subscription

Non-OA path NPD

Metrics

Scimago and CountryOfPapers database fields

Scopus / SJR Web of Science

SJR Impact

0,524

H-index

Docs (year)

Docs 3y

178

Total refs

2012

Cites 3y

511

Citable 3y

173

Cites/Doc 2y

2.85

Ref/Doc

34.1

Immediate OA

—

Embargoed OA

NPD

Non OA / Submission

—

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Best articles by citations

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Viscoelastic Warpage Analysis of Surface Mount Package

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Creep Analysis of Wafer Level Chip Scale Package (WLCSP) With 96.5Sn-3.5Ag and 100In Lead-Free Solder Joints and Microvia Build-Up Printed Circuit Board

Conjugate Heat Transfer From a Two-Layer Substrate Model of a Convectively Cooled Circuit Board

Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding

Comparison of First-Order Shear and Plane Strain Assumptions in Warpage Prediction of Simply Supported Printed Wiring Boards

Compact Modeling of Fluid Flow and Heat Transfer in Pin Fin Heat Sinks

Coatings Technology Handbook, Second Edition

Characterization of Lead-Free Solders in Flip Chip Joints

Birefringence Reducing Precision Replication Process Assisted by Infrared Radiation

Behavior of Lead-Free Solder Under Thermomechanical Loading

SHOW MORE ARTICLES

Applications of a Decomposed Analysis Procedure for Area-Array Packages

A Board Level Study of an Array of Ball Grid Components - Aerodynamic and Thermal Measurements

Analysis of the Micro-Mechanical Properties in Aged Lead-Free, Fine Pitch Flip Chip Joints

An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects

A Viscoplastic Constitutive Model for 63Sn37Pb Eutectic Solders

A Vapotron Effect Application for Electronic Equipment Cooling

A Study on Warpage of Flexible SS Substrates for Large Area MCM-D Packaging

A Study of Process-Induced Residual Stress in PBGA Packages

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

A New Creep Constitutive Model for Eutectic Solder Alloy

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products - Part II: Durability Analysis of Flip Chip and Chip Scale Interconnects

A Nested Finite Element Methodology (NFEM) for Stress Analysis of Electronic Products - Part I: Theory and Formulation

FAQs

Journal of Electronic Packaging, Transactions of the ASME has an SJR of 0,524 (best quartile Q2) in the CountryOfPapers database.

Immediate OA APC is not available (NPD).

The acceptance rate recorded for Journal of Electronic Packaging, Transactions of the ASME is 29%.

Journal of Electronic Packaging, Transactions of the ASME

Metrics

Name good journals. Call out predatory ones.

Researcher reviews

Best articles by citations

FAQs

What is the SJR of Journal of Electronic Packaging, Transactions of the ASME?

What is the APC / publication cost?

What is the acceptance rate?