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verified SJR 0,393 · Q2
Journal of Micro/ Nanolithography, MEMS, and MOEMS
United States · SPIE
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Journal of Micro/ Nanolithography, MEMS, and MOEMS

Journal of Micro/ Nanolithography, MEMS, and MOEMS is a journal indexed in SJR in Electronic, Optical and Magnetic Materials and Atomic and Molecular Physics, and Optics with an H index of 45. It has a price of 2395 €. It has an SJR impact factor of 0,393 and it has a best quartile of Q2. It has an SJR impact factor of 0,393.

ISSN: 1932-5150
Publisher: SPIE
Category: Electronic, Optical and Magnetic Materials
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schedule CountryOfPapers database fields
SJR Impact Factor trending_up
0,393 Q2
H-index 45
Acceptance rate pie_chart
32%
Source Acceptance_Rate
Time to publication hourglass_top
NPD
Field NPD
Publication cost (APC) payments
2.395 € Subscription
Non-OA path 0 €

Metrics

Scimago and CountryOfPapers database fields

SJR Impact

0,393

H-index

45

Docs (year)

65

Docs 3y

166

Total refs

1617

Cites 3y

309

Citable 3y

142

Cites/Doc 2y

1.78

Ref/Doc

24.88

Immediate OA

2395 €

Embargoed OA

NPD

Non OA / Submission

0 €

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Best articles by citations

Cost of Scaling

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Wide and continuous wavelength tuning of microcavity devices for optoelectronic applications

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Efficient magnetic microactuator with an enclosed magnetic core

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Effective exposure-dose monitor technique for critical dimension control in optical lithography

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Dynamic absorption coefficients of chemically amplified resists and nonchemically amplified resists at extreme ultraviolet

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Domain decomposition methods for the rapid electromagnetic simulation of photomask scattering

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Diffraction analysis of digital micromirror device in maskless photolithography system

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Desirable reticle flatness from focus deviation standpoint in optical lithography

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Design, fabrication, and characterization of a full complex-amplitude modulation diffractive optical element

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Design and fabrication of Fabry-Perot filters for infrared hyperspectral imagers

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Design and characterization of two-axis rotational micromirrors using multi-user microelectromechanical system processes

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Depth of focus in multilayered media - a long-neglected phenomenon aroused by immersion lithography

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157 nm lithography with high numerical aperture lens for the 70 nm technology node

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Continuous-tone grayscale mask fabrication using high-energy-beam-sensitive glass

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Complex two-dimensional pattern lithography using chromeless phase lithography

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Compact electron-based extreme ultraviolet source at 13.5 nm

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Co-optimization of the mask, process, and lithography-tool parameters to extend the process window

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Characterization of residual strain in SiC films deposited using 1,3-disilabutane for MEMS application

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Centrifugation and spin-coating method for fabrication of three-dimensional opal and inverse-opal structures as photonic crystal devices

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